India’s Semiconductor Roadmap to 2035:
“Future of India’s Semiconductor Industry”
The NITI Aayog has released India’s first
comprehensive 10-year roadmap titled “Future of India’s Semiconductor
Industry”, aimed at positioning India as a critical global semiconductor
ecosystem player by 2035.
Key Highlights of the Roadmap
Why India Must Act Now
¨
Nearly 90–95% of India’s
semiconductor demand is met through imports.
¨
Dependence on imported
chips poses strategic risks to defence, aerospace and critical infrastructure
systems.
¨
India spent nearly USD
150 billion on semiconductor imports during FY17–FY25, resulting in significant
foreign exchange outflows.
¨
Domestic semiconductor
production is essential for making future technologies such as 5G/6G devices
more affordable and accessible.
¨
Global supply-chain
diversification and the China-plus-One strategy have created a narrow but
critical window of opportunity for India to enter the semiconductor value
chain.
India’s Semiconductor Opportunity
¨
The global semiconductor
market is expected to exceed USD 1.5 trillion by 2035.
¨
India’s semiconductor
demand is projected to reach around USD 200 billion by 2035.
¨
At present, nearly 90–95%
of India’s semiconductor demand is met through imports.
¨
Global supply-chain
realignments and the search for trusted manufacturing destinations provide
India with a historic opportunity to strengthen its position in the value
chain.
Vision 2035: Becoming Indispensable, Not
Imitative
¨
India aims to capture
10–13% of the global semiconductor market by 2035.
¨
The roadmap seeks to
retain 55–70% of semiconductor value capture within India through local design,
packaging, materials and manufacturing ecosystems.
¨
The roadmap targets the
creation of a USD 120–150 billion semiconductor value chain by 2035.
The strategy is based on three pillars:
¨
Strategic
self-sufficiency.
¨
Ecosystem strength.
¨
Global indispensability.
The emphasis is on building leadership in areas where
India possesses structural advantages rather than competing directly in every
segment of the semiconductor industry. India aims to achieve 15–25% chip
self-sufficiency by 2030. Self-sufficiency is expected to increase to 35–50% by
2035.
Leadership in Advanced Packaging and OSAT:
¨
India aims to emerge as
one of the top three global destinations for advanced packaging and OSAT
(Outsourced Semiconductor Assembly and Testing).
¨
Focus areas include
Chiplets, 2.5D and 3D integration, Fan-Out Wafer Level Packaging (FOWLP),
Panel-Level Packaging (PLP) and System-in-Package (SiP) technologies.
¨
Advanced packaging is
identified as a major opportunity in the emerging “More-than-Moore” era.
Focus on Compound and Wide-Bandgap
Semiconductors
¨
The roadmap prioritises
leadership in Silicon Carbide (SiC) and Gallium Nitride (GaN) technologies.
¨
India aims to become a
major supplier of wide-bandgap semiconductor materials.
¨
These technologies are
critical for electric vehicles, renewable energy systems, power electronics,
telecom infrastructure and defence applications.
Strengthening Semiconductor Design
Capabilities
¨
Tiered subsidies for
Electronic Design Automation (EDA) tools are proposed to reduce design costs
and improve access for startups and researchers.
¨
An AI-enabled
Semiconductor Engineering Mission is proposed to shorten chip-design cycles
through agentic AI tools and automation.
¨
The roadmap targets the
creation of more than 100 advanced semiconductor design IPs by 2035.
¨
Priority areas include
AI-native chip design, high-performance computing, quantum computing, system
architecture and chiplet-based design.
¨
The objective is to move
from a design-services hub to a creator of globally competitive semiconductor
IP.
Building Domestic Manufacturing Capacity
¨
Wafer fabrication efforts
will primarily focus on mature logic nodes between 28 nm and 65 nm.
¨ Special emphasis is placed on analog, mixed-signal and power-management chips used in automotive, IoT and industrial applications.
¨ The roadmap recommends exploring Small Modular Reactors (SMRs) to provide reliable dedicated power for semiconductor fabrication clusters.