Odisha Signs MoU with Intel and 3D Glass
Solutions for Semiconductor Packaging Technology
¨
Odisha signed a
Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions on 28–29
May 2026 to bring substrate manufacturing technology to India.
¨
The agreement is related
to semiconductor packaging and advanced glass-based integration at Info Valley
in Bhubaneswar, located in Khordha district.
¨
Semiconductor packaging
involves enclosing and connecting integrated circuits for use in electronic
systems.
¨
Glass substrates are used
in advanced packaging because they support high-density interconnections in
heterogeneous integration and 3D packaging.
¨
The project was approved
under the India Semiconductor Mission in August 2025.
¨
It is being implemented
by 3D Glass Solutions Inc. through its wholly owned Indian subsidiary,
Heterogeneous Integration Packaging Solutions Private Limited.
¨
The total project cost is
estimated at ₹1,943.53 crore.
¨
The Central Government
will provide fiscal support of ₹799 crore.
¨
The Odisha Government
will provide additional support of approximately ₹399.5 crore.
¨
The facility is expected
to manufacture around 70,000 glass substrates annually.
¨
It is also expected to
produce about 50 million assembled units every year.
¨ The project aims to generate nearly 13,000 advanced 3D heterogeneous integration modules annually.
¨ The initiative is expected to strengthen India’s semiconductor manufacturing and advanced packaging ecosystem.
