Union Cabinet approved Semicon Mission 2.0
and the Mobile Phone Manufacturing Scheme
¨ Union Cabinet approved
Semicon Mission 2.0 and the Mobile Phone Manufacturing Scheme on 15 July 2026.
¨
Semicon Mission 2.0 has a
financial outlay of ₹1.27 lakh crore.
¨ The Mobile Phone
Manufacturing Scheme has a budgetary outlay of ₹62,500 crore.
¨ The India Semiconductor
Mission was launched in 2021 as the first phase of India's semiconductor
programme.
¨
Semicon Mission 2.0
extends the programme duration from 5 years to 12 years.
¨
The mission covers six
pillars of the semiconductor ecosystem.
¨
Chip design is one of the
six pillars under Semicon Mission 2.0.
¨
The mission includes
manufacturing of semiconductor equipment and materials.
¨
It provides support for
setting up additional semiconductor fabrication units (fabs).
¨ The programme also covers
advanced packaging, research and development (R&D), and talent development.
¨ The Mobile Phone
Manufacturing Scheme replaces the Production Linked Incentive Scheme for Large
Scale Electronics Manufacturing (PLI-LSEM).
¨
The scheme will be
implemented for five years, from FY2026–27 to FY2030–31.
¨
It offers incentives
ranging from 2.25% to 5% on eligible sales.
¨ An additional incentive
of up to 1.5% is available for domestic sourcing of components.
An additional 3% incentive is provided for design and research & development
